Content
05/29/2024
Chandler, AZ USA
Axus Technology
completed $12.5 million Series A Round funding. Investors include
IntrinSiC Investment.
About
Axus Technology delivers advanced process development expertise, equipment, and service support for:
-- CMP & Polishing
-- Wafer Thinning and Grinding
-- Edge Grinding and Profline
-- Substrate Cleaning Applications
-- Wafer Bonding Applications.
Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner.
Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment.
The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.
Startup
Sector:
Tech
Industrial
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